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A regularly updated section featuring the latest component releases. Components shown here are sent to us directly by companies as they announce them worldwide. If your company wants to feature components here, please get in touch with us.

World’s First Hand Controlled Robotic Kit

Ziro UI has created a modular robotics kit that is controlled entirely by the wave of your hand and fingers. Perfect for building yourself a new puppet friend.Ziro lets you design,...

MaxCore HA: Server Mount With Higher Cell Capacity

Artesyn Embedded Technologies launched the MaxCore HA platform, a microserver platform for NFV/SDN and carrier cloud networks, including new network components such as the cloud/virtualized radio access network (C-RAN/vRAN). It is...

‘MiraVision’ brings FHD TV to your mobile phones

Mediatek is now focussing on providing robust and comprehensive LTE, VoLTE and VoWiFi suite parallely certifying ViLTE and eMBMS to meet the diverse requirements of Indian smartphone users. From within its Helio...

Flash Storage Solutions to Target New, Intelligent Apps in the Cloud

IBM has announced an expansion of its flash storage portfolio to help clients more quickly extract value from data so it can be turned into a competitive advantage. IBM launched three new...
AMS sensor

Extremely Small Magnetic Sensors From AMS

Austria based AMS AG have developed two magnetic position sensor chips, in automotive safety compliant sensors developed using the automotive industry’s programme for ISO26262 safety compliance. The AS5170 and AS5171 sensors...

15-nanometer three-bits-per-cell based Half-Terabyte SSD Announced

SanDisk Corporation, a global leader in flash storage solutions, today announced the SanDisk Z410 SSD, a half-terabyte solid state drive (SSD) that enables manufacturers to design for a broad range of...

“The Switch To Higher Voltage Bus Distribution Will Improve Systems In The Wider Market”

Power management chips are a part of every product. This interview takes a look at what technologies are shaping this space. Andy Gales, VP International Sales at Vicor Corp speaks with Dilin...
Aluminium wires

Alternative Developed for Ball Wire Bonding

After four years of R&D, a team led by Taiwan's National Cheng Kung University (NCKU) professors has overcome problems such as the poor conductivity and ductility of aluminum and developed fine...

Samsung Said to Supply Apple with NAND Flash Memory in 2017

Samsung is once again set to begin supplying Apple with NAND flash memory chips in 2017, ending a five-year hiatus dating back to the debut of the iPhone 5 in 2012,...
MediaTek RTOS HDK

Development Platform for RTOS from MediaTek

A new hardware Development Kit from MediaTek supporting IoT devices, was announced on Tuesday. MediaTek LinkIt™ Development Platform for RTOS, is a first from MediaTek, delivering a common tool chain, and...

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