New series of Bluetooth Low Energy microcontrollers and modules is now available, offering solutions for diverse applications such as automotive systems, industrial IoT, and consumer electronics.
Infineon Technologies AG has expanded its Bluetooth portfolio with eight new products in the AIROC CYW20829 Bluetooth Low Energy 5.4 microcontroller (MCU) family. These new offerings include Systems-on-Chip (SoCs) and modules designed for industrial, consumer, and automotive applications. The CYW20829 family offers high integration, enabling designers to reduce both bill-of-material (BOM) costs and device footprints across various applications, such as PC accessories, low-energy audio, wearables, solar microinverters, asset trackers, health and lifestyle products, and home automation.
The new products currently in production are:
- CYW20829B0000: 56QFN SoC, 6×6 mm, ideal for PC accessories, remotes, ESL, and low-end BLE MCUs.
- CYW20829B0010: 56QFN SoC, 6×6 mm, designed for gaming accessories and LE Audio products.
- CYW20829B0-P4EPI100 & CYW20829B0-P4TAI100: Modules, 14.5×19 mm, suitable for long-range asset tracking, power tools, and generic Bluetooth LE applications.
- CYW20829B0021: 40QFN SoC, 6×6 mm, optimised for industrial and long-range use.
- CYW89829B0022: 40QFN SoC, 6×6 mm, tailored for wireless BMS and car access.
- CYW89829B0232: 77BGA SoC, 7×8 mm, suitable for wireless BMS and car access.
The company supports product designers with a robust development infrastructure and advanced security features, including secure boot, secure execution environments, and cryptography acceleration to protect sensitive data. The AIROC CYW89829 Bluetooth Low-Energy MCU, part of this product family, is tailored for automotive applications like car access and wireless battery management systems (wBMS). This MCU features strong RF performance, extended range, and the latest Bluetooth 5.4 functionalities, such as Periodic Advertising with Responses (PAwR). The dual ARM Cortex core design includes separate subsystems for application and Bluetooth Low Energy functions, supporting Bluetooth 5.4, low-power operation, 10 dBm output power, integrated flash, CAN FD, crypto accelerators, and high security features, including Root of Trust (RoT). It is also PSA level 1 ready.
Shantanu Bhalerao, Vice President of the Bluetooth Product Line at Infineon Technologies, emphasized that the company’s Bluetooth solutions are designed to deliver strong connectivity and the latest features across automotive, industrial, and consumer markets. Kevin Wang, CEO of ITON, highlighted the CYW20829 as a market leader in Bluetooth, with strong RF performance and support for PAwR and LE Audio. Cai Yi, CEO of Pairlink, praised its performance and range for commercial lighting and industrial IoT applications. Tapan Pattnayak, Chief Scientist at Addverb, noted its suitability for secure monitoring and control systems in industrial warehouses.
The new products are available in various configurations, each tailored for specific applications. Current products in production include several SoC packages and modules, with additional samples expected in 2025.
