The latest in 3D inspection technology, designed for electronics manufacturing with imaging, multi-height capability, and Smart Factory compatibility.
Test Research, Inc. (TRI) has introduced the TR7700QC SII, part of its Core Features 3D AOI lineup, developed for the electronics manufacturing sector. This system includes programming for setup, IPC-610 inspection algorithms, optional AI capabilities, and compliance with Smart Factory standards. The TR7700QC SII has a 12 MP camera and four factory-configurable settings from 10 μm to 15 μm.
The system uses IPC-610-compliant algorithms to identify solder joint defects, including those in THT components. Operators can examine detected flaws using 3D models, such as lifted BGA components, IC leads, connectors, switches, and other mounted devices.
The TR7700QC SII features a Multi-Step Function that allows inspection of tall components up to 40 mm and shorter ones in the same cycle. It supports Smart Factory standards, including the IPC-CFX and The Hermes Standard (IPC-HERMES-9852).
Some of the key specifications of the AOI includes the following:
- Imaging Method: Stop-and-Go
- Top Camera: 12 MP High-Speed Camera
- Angle Camera: N/A
- Imaging Resolution: 10 µm, 12 µm, 15 µm (factory setting)
- Lighting: Multi-phase True Color LED
- 3D Technology: Quad Digital Fringe Projectors
- Max. 3D Range: 40 mm
The TR7700QC SII 3D AOI is outfitted with key inspection functionalities suitable for various applications within the electronics manufacturing industry. This 3D AOI includes straightforward programming for simple setup, adaptable IPC-610 inspection algorithms, and meets the latest Smart Factory standards.
The 3D AOI has essential features for inspecting components and solder joints, including user-friendly programming and flexible IPC-610 algorithms. It offers an industry-leading inspection speed of up to 57 cm²/sec and can handle tall components with a 3D height range of up to 40 mm. This system is also ready for integration with Smart Factory solutions.
