The advanced power modules significantly boost energy efficiency and performance in data centres, reducing costs and enhancing operations.
Data centres currently use over two per cent of the world’s energy, a figure projected to rise to around seven per cent by 2030 due to the demands of AI, equating to the energy usage of India. It’s crucial to optimise power conversion from the grid to the core to enhance power densities, improve computing performance, and reduce the total cost of ownership (TCO). Infineon Technologies AG has launched the TDM2354xD and TDM2354xT dual-phase power modules for AI-driven data centres. These modules provide vertical power delivery (VPD) and a current density of 1.6 A/mm^2, following the TDM2254xD models launched earlier by Infineon.
The modules are suitable for organisations operating data centres that require higher power density and energy efficiency to manage computational tasks associated with artificial intelligence. These modules would also benefit enterprises looking to optimise their data centre operations to reduce the total cost of ownership and improve system performance, especially in environments where space and thermal management are important.
The modules use Infineon’s OptiMOS 6 trench technology, a chip-embedded package that improves power density through better electrical and thermal efficiencies, and a new inductor technology for a lower profile, enabling vertical power delivery. These modules set standards in power density and quality, enhancing the performance and efficiency of AI data centres. The modules support up to 160 A and are the industry’s first Trans-Inductor Voltage Regulator (TLVR) modules in an 8 x 8 mm² form factor. When used with Infineon’s XDP controllers, these modules provide a rapid transient response and reduce on-board output capacitance by up to 50 per cent, thus increasing system power density.
“We are proud to enable high-performance AI data centres with our TDM2354xT and TDM2354xD VPD modules. These devices will maximise system performance with Infineon’s trademark quality and robustness, thereby enabling the best TCO for data centres,” said Rakesh Renganathan, Vice President of Power ICs at Infineon Technologies. “Our industry-leading power devices and packaging technologies, combined with our extensive systems expertise will further advance high-performance and green computing as part of our mission to drive digitalization and decarbonization.”
