Researchers have developed an innovative technique to bond diamonds with materials suitable for both quantum and conventional electronics, opening new doors for quantum computing and electronic manufacturing.
The team from the University of Chicago’s Pritzker School of Molecular Engineering (UChicago, PME) and Argonne National Laboratory (ANL) devised this breakthrough method by engineering slight defects in synthetic diamonds. This process enables the direct integration of diamonds into devices without the need for bulk materials, which could significantly advance the development of quantum computers and sensors.
Synthetic diamonds possess unique qualities, such as extreme durability, excellent thermal conductivity, and chemical stability, making them ideal for advanced electronics. However, their integration into technology has been challenging due to a limitation known as homoepitaxy—diamonds can only grow on other diamonds. This obstacle has restricted the full potential of diamonds in quantum and conventional applications.
“Diamond stands alone in terms of its material properties,” said Alex High, Assistant Professor, UChicago, PME. “But as a platform, it’s actually pretty terrible.”
This advancement is particularly significant for industries such as quantum computing, telecommunications, and electronics manufacturing. Companies developing next-gen computing hardware, quantum sensors, and high-performance devices like smartphones and diagnostic tools could greatly benefit from this innovation. The method’s ability to bond diamonds directly to materials like silicon or sapphire could streamline production, reduce costs, and improve performance, making it a game-changer for sectors that rely on precise measurements and efficient power management.
The breakthrough came when the team successfully bonded a nanoscale diamond film, as thin as 10 nanometers, to sapphire without the need for intermediary substances. This innovative approach allows for the integration of diamond with a range of materials, including silicon, sapphire, and thermal oxide, making it applicable for both quantum and conventional electronics.
“We make a surface treatment to the diamond and carrier substrates that makes them very attractive to each other,” said Xinghan Guo, first author, UChicago, PME . This process enhances the bond and strengthens the diamond’s durability, allowing it to withstand complex nanofabrication.
In quantum research, slight defects in diamonds create qubits that are essential for quantum computing and sensing. “Diamond is a wide bandgap material. It’s inert,” said F. Joseph Heremans, Co author & Staff Scientist, ANL, US. “Its raw physical properties tick a lot of marks that are beneficial to a lot of different fields.”
This new bonding technique could revolutionize the integration of diamonds in technologies such as quantum sensors, phones, and computers. By creating thin diamond films, the research team hopes to spark a “CMOS-style revolution” for quantum technologies, similar to the advances made in transistors during the 20th century.
