The COM-HPC Mini packs powerful computing into compact devices like robots, drones, and industrial automation systems, ensuring top-tier performance in tight spaces.
The COM-HPC Mini introduces a new specification within the COM-HPC ecosystem, aimed at enhancing high-performance computing in a much smaller footprint. As part of the broader COM-HPC family, which includes the high-performance standards for client and server modules, COM-HPC Mini focuses on delivering top-tier performance in a compact size of just 95mm×70mm. This smaller form factor makes it ideal for applications where space is at a premium but high performance is non-negotiable, such as DIN-rail PCs in industrial automation or portable test and measurement devices.
Despite its diminutive size—nearly half that of its closest COM-HPC relative—the Mini variant does not compromise on capabilities. It offers a robust solution for autonomous mobile robots, drones, and mobile 5G devices, which require efficient, high-performance modules within a constrained space. The design also features a reduced stack height of 15mm from the carrier board to the top of the module, a decrease from other variants by 5mm. This necessitates the use of soldered memory to boost durability and enhance thermal coupling to heat spreaders, ensuring performance amidst physical and thermal challenges.
| COM-HPC module classes | |||
| Feature | COM-HPC Server Module | COM-HPC Client Module | COM-HPC Mini Module |
| Application | Edge computing in harsh environments such as autonomous vehicles, cell tower base stations | High-end embedded applications like medical equipment, industrial systems, casino gaming, rugged PCs | Small form factor applications needing high-end computing power |
| Display requirements | Headless (no display required) | Requires one or more displays | N/A (not specified) |
| Memory capacity | Up to eight full-size DIMM slots | Up to four SO-DIMM slots | Not specified but uses a single 400-pin connector |
| I/O capabilities | Multiple high-speed Ethernet ports (10Gbps or 25Gbps), up to 65 PCIe lanes | 49 PCIe lanes | USB 4.0, Thunderbolt, PCIe Gen 5, 10Gbps Ethernet |
| Input power | Minimum 358W; compatible with CPUs dissipating up to 150W | Up to 251W at the lower end of an 8V power supply, more with stable 12V supply | Up to 107W at the lower end of an 8V spectrum |
| Design considerations | Robust, durable, and upgradable for tough conditions | Geared towards applications demanding high graphical performance and advanced I/O bandwidths | Compact, power-efficient design for high performance in credit-card-sized package |
| Unique attributes | Excels in CPU performance and extensive I/O bandwidth, perfect for harsh environments | Ideal for applications needing displays and varied I/O options | Performance-oriented despite space, power, or cost constraints |
As the technology landscape evolves, the demand for smaller yet powerful computing solutions is becoming increasingly crucial. The PICMG (PCI Industrial Computer Manufacturers Group) has responded by developing COM-HPC Mini. This new standard not only continues the legacy of the original COM-HPC modules, but also complements smaller form factors like COM Express Mini, providing a significant upgrade in performance and interface capabilities for space- and power-limited applications. As we move forward, COM-HPC Mini is set to redefine the potential of small form factor computing modules, pushing the boundaries of what can be achieved in embedded systems.
| COM-HPC Mini vs COM-HPC |
| • Connector configuration. COM-HPC Mini utilises a single high-speed connector, whereas the larger COM-HPC Client and Server use two connectors •Compatibility. The design changes in the COM-HPC Mini, including the connector and interface adjustments, result in incompatibility with the Client and Server • Signal pin capacity. Although COM-HPC Mini has half the number of signal pins compared to larger modules, it still provides 400 high-speed signal lanes, representing 90% of the capacity of COM Express Type 6 modules • Memory configuration. COM-HPC Mini modules require soldered memory to enhance ruggedness, improving resistance to shock and vibration, and increasing overall efficiency • Market position. Unlike other small form factor standards like COM Express Mini, COM-HPC Mini is designed as a complementary standard that meets the needs of applications requiring high performance in a compact space • Size and application. COM-HPC Mini is significantly smaller than the next-smallest COM-HPC form factor and is specifically targeted for cost-effective, lower-power applications in autonomous mobile robots, drones, mobile 5G test and measurement equipment, and other far-edge applications |
CoM standard module classes
COM-HPC modules represent the next step in embedded systems, providing advanced features to meet the increasing need for high-speed, scalable performance. They come in three types, each suited to different needs, from powerful computing in harsh conditions to compact, space-saving solutions. The table on first page compares the key features of these three COM-HPC module classes.
It is important to note that power capacity for all COM-HPC modules can vary based on factors such as connector pin de-rating (which typically reduces the rated power by 20%), the number of memory sockets utilised, and the power demands of other components on the module. These variables must be taken into account when designing a system to ensure optimal performance and longevity.
COM-HPC Mini simplifies embedded computing
The COM-HPC Mini targets applications requiring compact, powerful computing solutions, including mobile systems in medical technology, rugged battery-powered tablets, and size-constrained automated guided vehicles (AGVs) and autonomous mobile robots (AMRs). It is likely to become a preferred choice in these areas.
The COM-HPC Mini complements existing standards like COM Express Mini to meet new demands, suitable for developers upgrading or creating designs without needing the highest performance or advanced interface technology. Many designs can operate effectively without maximum performance and bandwidth.
Credit-card-sized modules have shown the need for diverse standards that coexist, fulfilling various roles over decades. The COM-HPC Mini uses a single connector, unlike the two in the larger COM-HPC Client and Server modules. With 400 signal pins, it delivers much of the performance capacity of the COM Express Type 6 modules but in a smaller size. This size fits embedded computing in specialised devices, such as top-hat rail PCs in control cabinets for building and industrial automation, and portable test and measurement equipment.
The specification supports PCIe Gen4 and Gen5, ensuring performance remains intact. Despite a reduction in pin count, the COM-HPC Mini seamlessly integrates into the broader COM-HPC ecosystem.
The COM-HPC Mini includes I/O capabilities such as USB4 and SoundWire, along with Ethernet capabilities through 2x NBaseT and 2x RGMII ports shared with PCIe lanes. It supports the SATA interface, but newer applications are expected to use the NVMe interface through dedicated PCIe lanes. The design optimises pin usage by sharing 8 high-speed data lanes among various interfaces, including DDI (digital display interface), USB 3.x, and USB4.
| The features at a glance |
| • Compact size. Measuring only 95mm x 70mm, significantly smaller than the COM-HPC Client Size A, ideal for space-limited applications • Interface adjustment. Includes a shift to a single high-speed connector with a distinct pinout to minimise form factor and enhance functionality, supporting interfaces like USB 4.0, Thunderbolt, PCIe Gen4/5, and 10Gbit/s Ethernet • Incompatibility with larger modules. Design adjustments make COM-HPC Mini modules incompatible with the client and server specifications • High performance capacity. Despite its compact form, it supports up to 76 watts of power consumption, enabling high-performance processors like Intel Core • Reduced heat dissipation. Specifies a reduced maximum heat dissipation in line with its compact and power-efficient design • Rugged design. The overall height of the module and heat spreader is reduced by 5mm, requiring only 15mm above the carrier surface. This reduction facilitates integration into slim designs like mobile devices and panel PCs • Soldered memory. Incorporates soldered memory to enhance durability and resistance to shock and vibrations, and improves cooling efficiency through direct thermal coupling to the heat spreader |
The strategic shift to COM-HPC Mini
The physical build of the COM-HPC Mini further underscores its utility in demanding environments. The move to a lower profile has led to the adoption of soldered memory, which is less susceptible to damage from shock and vibrations and allows for direct thermal coupling to heat spreaders, enhancing the module’s durability and thermal efficiency. These features ensure the COM-HPC Mini’s performance remains top-notch even in its smaller, rugged format.
The COM-HPC 1.2 specification, ratified in October 2023, introduced the COM-HPC Mini, thus expanding the standard to accommodate more compact formats. This addition not only escalates the scalability of the COM-HPC standard but also enhances its application range across various high-performance computing environments.
Companies like Kontron have taken immediate steps to innovate within this new format, developing COM-HPC Mini modules that harness Intel Core technology to deliver powerful performance in compact spaces. Similarly, Congatec’s upcoming COM-HPC Mini ecosystem is designed to address the needs of advanced embedded systems, including embedded vision, featuring dual MIPI-CSI interfaces for applications with stringent space and power constraints. This development signifies a broader shift towards versatile, high-performance modules that cater to the evolving demands of modern technology applications.
The introduction of COM-HPC Mini modules now enables vendors to consider upgrading existing systems with minimal adjustments. The potential for drone manufacturers, for instance, to adapt to new performance classes without extensive redesigns underscores the modular approach’s cost-effectiveness and efficiency. This adaptability is pivotal, particularly when only minor modifications to carrier boards are necessary to meet new standards. This approach underlines the potential for long-term design security and adaptability within the industry, reflecting a shift towards standardising modular design in high-performance computing environments.
As part of the broader COM-HPC family, this compact module offers an ideal solution for space-constrained applications that still require robust computing power. By combining durability, efficient thermal management, and advanced I/O capabilities, the COM-HPC Mini opens up new possibilities in industries, ranging from industrial automation to mobile robotics. Its adaptability and performance in small spaces highlight the ongoing shift toward more flexible, modular design in embedded systems, ensuring that the COM-HPC ecosystem continues to evolve to meet the growing demands of modern technology.
Nidhi Agarwal is Senior Technology Journalist at EFY. She is an Electronics and Communication Engineer with over five years of academic experience. Her expertise lies in working with development boards and IoT cloud. She enjoys writing as it enables her to share her knowledge and insights related to electronics, with like-minded techies.
