Microchip’s latest power device enhances the power efficiency in diverse sectors including e-mobility, sustainability, and data centres.
Microchip Technology has introduced its new IGBT 7 power device portfolio, designed to meet rising demands for efficiency and performance in power electronics. Engineered with a range of voltage and current options, these devices support applications across sustainability initiatives, e-mobility, and data centres. The devices are available in multiple topologies and configurations, offering system designers and industrial engineers flexibility and versatility in selecting optimised solutions for specific power requirements.
Targeted for high-growth markets, the new power device portfolio delivers crucial performance in applications like solar inverters, hydrogen energy systems, commercial and agricultural vehicles, and more electric aircraft (MEA). The portfolio addresses the needs of automotive, aerospace, and green energy sectors, providing options suitable for environments demanding high performance and reliability. The company provides these devices in a variety of packages such as D3, D4, SP6C, SP1F, and SP6LI, each suited to different configurations, including three-level neutral-point clamped (NPC), three-phase bridge, boost chopper, buck chopper, and T-type topologies. These configurations allow for effective integration into diverse systems, supporting voltages from 1200V to 1700V and currents ranging from 50A to 900A.
Leon Gross, corporate vice president (discrete product group), Microchip commented, “The versatile IGBT 7 portfolio combines ease of use and cost efficiency with higher power density and reliability, offering our customers maximum flexibility. These products are designed for general industrial applications as well as specialised aerospace and defence applications.” The reliable performance characteristics and flexibility of these devices make them adaptable to industrial and advanced applications, such as propulsion, actuation, and power distribution in aviation and defence sectors.
These devices offer improved power density, lower power losses, and higher reliability, aided by features such as reduced on-state IGBT voltage (Vce), improved antiparallel diode characteristics, and increased overload capability at higher operating temperatures. For motor control applications where precise dv/dt controllability is essential, these devices offer freewheeling softness, minimising EMI and voltage spikes for smoother and optimised switching performance.
The power device portfolio forms part of its broader power management range, which includes silicon (Si) and silicon carbide (SiC) technologies, analog components, and dsPIC digital signal controllers (DSCs). Available in production quantities, these devices are accessible through the company’s sales channels and distributors. For further details, designers and engineers can click here.
