The latest optical chipset redefines high-speed data centre interconnects, addressing limitations of traditional copper cables.
Marvell Technology, based in California, has introduced a 1.6Tbps transimpedance amplifier (TIA) and laser driver chipset, optimised for next-generation compute fabric connectivity in data centres. This innovation caters to the growing demands of artificial intelligence (AI)-driven networks, enabling high-bandwidth, short-reach optical solutions that outperform conventional copper interconnects.
As AI continues to transform industries, data centres are experiencing surging demand for faster and more efficient interconnect solutions. The transition to 200Gbps per lane data rates is rendering passive direct-attached copper (DAC) cables inadequate, prompting the need for scalable optical alternatives. Designed with cloud operators, AI researchers, and large-scale data centre providers in mind, Marvell’s new LPO chipset ensures extended reach, lower latency, and higher data throughput for AI workloads.
The linear-drive pluggable optics (LPO) chipset is a superior choice for short and predictable host channels in compute fabric networks. With its best-in-class linearity and low bit error rates, the TIA paired with the laser driver delivers enhanced module performance while reducing power consumption and design complexity.
“This chipset directly addresses the bottlenecks in short-reach, high-bandwidth interconnects where copper falls short,” said Xi Wang, vice president, optical connectivity, Marvell. “As data centres scale for AI, our innovative LPO chipset expands connectivity options, optimising cost and performance across network layers.”
Experts have acknowledged the significance of this development in advancing AI networking. Alan Weckel, co-founder of 650 Group, remarked, “Marvell’s focus on short-range optimisation gives LPO technology a scalable edge, improving AI cluster efficiency and reducing total cost of ownership.”
The LPO chipset forms part of Marvell’s comprehensive interconnect portfolio, which includes PAM4 optical DSPs, coherent DSPs, and the Ara 3nm PAM4 interconnect platform. Together, these technologies aim to enhance data centre performance and future-proof cloud infrastructure.
By addressing critical challenges in compute fabric connectivity, Marvell’s 1.6Tbps chipset sets a new benchmark in optical networking, giving potential for more robust and scalable AI-powered systems.
