- Intel’s core processors equipped with Intel Hybrid Technology feature an enhanced hybrid CPU architecture to offer reliable performance
- They have the ability to take on more intense workloads and foreground applications, thus enabling lighter design system to achieve better operation
Intel has launched Intel Core processors with Intel Hybrid Technology, code-named “Lakefield.” Leveraging Intel’s Foveros 3D packaging technology and featuring a hybrid CPU architecture for scalable power and performance, Lakefield processors come in a small size to deliver Intel Core performance and full Windows compatibility for increased productivity and content creation experiences.
Intel Core processors with Intel Hybrid Technology deliver full Windows 10 application compatibility in a 56 per cent smaller package area for up to 47 per cent smaller board size and extended battery life. This provides OEMs more flexibility in form factor design across single, dual and foldable screen devices while delivering amazing PC experiences. They are also:
- The first Intel Core processors with attached package-on-package (PoP) memory, further reducing board size.
- The first Intel Core processors to deliver as low as 2.5mW of standby SoC power – a 91 per cent reduction compared to Y-series processors – for more time between charges.
- The first Intel processors to feature native dual internal display pipes, making them ideally suited for foldable and dual-screen PCs.
Full compatibility
Intel Core i5 and i3 processors with Intel Hybrid Technology leverage a 10nm Sunny Cove core to take on more intense workloads and foreground applications, while four power-efficient Tremont cores balance power and performance optimization for background tasks. The processors are fully compatible with 32- and 64-bit Windows applications, helping reach new heights for the thinnest and lightest designs.
- Smallest package size, enabled by Foveros: With Foveros 3D stacking technology, processors achieve a dramatic reduction in package area – only a minuscule 12x12x1 mm, approximately the size of a dime – by stacking two logic dies and two layers of DRAM in three dimensions, also eliminating the need for external memory.
- Hardware-guided OS scheduling: It enables real-time communication between the CPU and the OS scheduler to run the right apps on the right cores. The hybrid CPU architecture helps deliver up to 24 per cent better performance per SOC power and up to 12 per cent faster single-threaded integer compute-intensive application performance.
- More than 2x throughput on Intel UHD for AI-enhanced workloads: Flexible GPU engine compute enables sustained, high-throughput inference applications – including AI-enhanced video stylization, analytics and image resolution upscaling.
- Up to 1.7x better graphics performance: Gen11 graphics delivers seamless media and content creation on the go. It allows you to convert video clips up to 54 per cent faster. With support for up to four external 4K displays, it offers rich visuals for content creation and entertainment.
- Gigabit connectivity: With support for Intel Wi-Fi 6 (Gig+) and Intel LTE solutions, experience seamless video conferencing and streaming online.
Two designs powered by the Intel Core processors with Intel Hybrid Technology and co-engineered with Intel have been announced: the Lenovo ThinkPad X1 Fold, a fully functional PC with a folding OLED display and the Intel-based Samsung Galaxy Book S – expected to be in markets this year.
“Intel Core processors with Intel Hybrid Technology are the touchstone of Intel’s vision for advancing the PC industry by taking an experience-based approach to designing silicon with a unique combination of architectures and IPs. Combined with Intel’s deepened co-engineering with our partners, these processors unlock the potential for innovative device categories of the future,” said Chris Walker, Intel corporate vice president and general manager of Mobile Client Platforms
