Thursday, December 12, 2024

Industry’s First Memory Interface Chipset Solutions

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The industry’s first complete chipset solutions for next-gen DDR5 MRDIMMs, boosting performance and speed for AI, HPC, and data centres.

Industry’s First Memory Interface Chipset Solutions
Industry’s First Memory Interface Chipset Solutions

Renesas Electronics Corporation has announced the industry’s first complete memory interface chipset solutions for second-generation DDR5 Multi-Capacity Rank Dual In-Line Memory Modules (MRDIMMs).

These MRDIMMs address the growing memory bandwidth requirements of Artificial Intelligence (AI), High-Performance Computing (HPC), and other data centre applications. They achieve operating speeds of up to 12,800 Mega Transfers Per Second (MT/s), a 1.35x increase in memory bandwidth compared to first-generation solutions. Renesas worked with CPU and memory providers and end customers to develop and deploy these MRDIMMs.

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The solution includes three components for DDR5 MRDIMMs. The RRG50120, a second-generation Multiplexed Registered Clock Driver (MRCD), buffers the Command/Address (CA) bus, chip selects, and clocks between the host controller and DRAMs, reducing power consumption by 45% compared to the first generation. The RRG51020, a second-generation Multiplexed Data Buffer (MDB), handles data buffering between the host CPU and DRAMs to support increased data rates. The RRG53220, a second-generation Power Management Integrated Circuit (PMIC), provides electrical overstress protection and power efficiency for high-current and low-voltage operation.

These components enable speeds of up to 12.8 Gigabytes per Second (GB/s). Renesas also provides temperature sensor (TS) and serial presence detect (SPD) hub solutions, making it the only memory interface provider with a complete chipset for next-generation MRDIMMs and other server and client DIMMs.

“The demand for higher performance systems driven by AI and HPC applications is relentless,” said Davin Lee, Senior Vice President and General Manager of Analog & Connectivity and Embedded Processing. “Renesas is at the forefront of this trend, working with industry leaders to develop next-generation technology and specifications. These companies depend on Renesas to deliver the technical know-how and production capabilities required to meet unprecedented demand. Our latest chipset solutions for second-generation DDR5 MRDIMMs showcase our leadership in this market.”

For more information, click here.

Nidhi Agarwal
Nidhi Agarwal
Nidhi Agarwal is a journalist at EFY. She is an Electronics and Communication Engineer with over five years of academic experience. Her expertise lies in working with development boards and IoT cloud. She enjoys writing as it enables her to share her knowledge and insights related to electronics, with like-minded techies.

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