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Location: Bengaluru
Company: Boeing
The Boeing Company is seeking an Associate Digital Electronics Design & Analysis Engineer. Boeing India Engineering oversees the design, development, manufacture, integration and testing of LRU designs for various Avionics systems. This position is located in Bangalore, Karnataka.
Primary Responsibilities
- Design and development of state-of-the art electronics for commercial aviation systems.
- Duties will include circuit design, requirements and interface definition, modeling and analysis, testing, performance and design verification
- Support projects involving digital and analog circuit design.
- Responsible for digital design, worst case circuit analysis, and communications systems
- Ability to simplify circuits and explain the underlying concepts clearly
- Develop high speed interface-based circuit designs and work with mechanical teams for thermal analysis and electromechanical packaging.
- Use DFM, DFA and DFT concepts to create manufacturable and testable designs.
Basic Qualifications (Required Skills and Experience)
- Bachelor’s in engineering degree or higher is required as a basic qualification.
- 7 or more years’ in Electronics Design.
- Experience with Analog, Digital and Power Design.
Preferred Qualifications (Desired Skills/Experience)
- Experience with digital/analog power electronics.
- Experience with digital board design
- Electronics-oriented work experience
- Circuit Design and Analysis application of Six Sigma principles preferably.
- Electromagnetic Interference (EMI) Analysis experience. Good understanding of grounding and shielding concepts, chassis design.
- Avionics sensor interface designs (Resolvers/Synchro, ADC, DAC).
- Experience on processor-based architectures and design interfaces.
- Design and Testing of DDR3/4, PCIe gen3, USB3, LPDP, MIPI, SATA, Ethernet and I2C/SPI/UART buses
- Selection of components to be used in Avionics Electronics Designs, like but not limited to, DDR, memory, storage media flash, ethernet controllers.
- Good understanding of ARINC 429, ARINC 818 and MIL 1553.
- Experience with Power Integrity analysis, Hyperlynx SI, Timing Analysis.
- Experience with Mentor suite of eCAD tools
- Experience with Manufacturing of Electronic Assemblies (manufacturing readiness assessments, Rapid Prototyping, dfmat, electronics manufacturing) Experience with Manufacturing of Electronic Assemblies (manufacturing readiness assessments, Rapid Prototyping, dfmat, electronics manufacturing)
- Preferred to have candidates who have knowledge upon high reliability system designs (redundancy, single event failures, safety flow analysis and similar concepts)
- Experience and development and certification to DO-160, DO-254, MIL-STD 810
- Knowledge in one or more of the following areas: CPU/SOC. Power (DC-DC converters, battery, power management, low power design), analog circuits, audio/camera/display/wireless integration and measurement, sensor design and integration.
- Experience over RF Design integration capabilities for Wireless communications and 5G integration
- Ownership of all technical documents of the product (e.g. Product specs, HW specs, Design review records, DVT plan, Compliance test plans)
- Proficiency in developing CODEC and Audio solutions
- Simulation experience and creation of behavioral models with MATLAB and SABER.
Typical Education & Experience
- Degree and typical experience in engineering classification: Bachelor’s and 7 or more years’ experience, Master’s degree with 5 or more years’ experience or PhD degree with experience. Bachelor, Master or Doctorate of Science degree from an accredited course of study, in engineering, computer science, mathematics, physics or chemistry. ABET is the preferred, although not required, accreditation standard.
