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APPLY HERE
Location: Sanand
Company: Micron Technology
Responsibilities and Tasks
- Identify and communicate yield issues on production and test wafers
- Analyze probe, parametric and fab data to identify yield issues
- Perform electrical and visual characterization of failing die to establish fail mechanism.
- Deprocessing of failing die to identify defects
- Publish and present reports on analysis of process experiments detailing yield impact.
- Apply knowledge of Si fabrication steps to identify and trouble shoot yield issues.
- Identification of yield excursions and correlation back to root cause.
- Detects complicated process interactions and relates it to failures. Provides, feedback to increase yield goals
- Identifies unexpected fail mechanisms and helps resolve underlying issues.
- Identify interactions between process modules and/or equipment to detect fail mechanisms.
- Using Device Physics knowledge relate parametric shifts to yield issues
- Demonstrate expertise in product architecture, cell operation, probe flows, and related topics to increase yield.
- Propose methods to determine solutions for new fail mechanism
- Recognize opportunities for yield improvements and provide feedback to R&D management.
- Standardize methods and procedures to promote consistent, comparable, and repeatable processes to improve yield.
- Use innovative methods to tackle highly complex problems
- Define and implement plans to solve outstanding yield issues that will drive quality and optimize yield.
Safety Related
- Identify and promptly report hazards
- Follow safety procedures and area work rules including proper PPE, lockout and chemical safety.
- Operate and maintain equipment and tools within manufacturer’s and company guidelines
- Use proper lifting techniques and work in an ergonomically correct manner
Requirements
- Bachelor’s degree in electrical / electronic engineering or a related field
- Experience working with tools such as bench testers, Oscilloscopes, Curve Tracer etc.
- 2+ Years of industry experience or demonstrable experience in debugging electrical failures of semiconductor memory
- Knowledge of assembly process like wire bond, die-attach, DBG, Molding, Saw singulation, laser mark, laser cut, etc. is a plus
