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Location: Bengaluru
Company: NXP Semiconductors
Purpose Of The Job
The RF IC Designer is part of a multifunctional team including RF IC architects, Design Engineers, Validation Engineers, Test-Product Engineers and Project leaders. The capabilities in the team enable innovation and product development of RF IC products from roadmap request up to full market release. The team is mainly working on IC products for Mobile Handset and Base Station equipment in the fields of Wireless LAN and 5G mmW transceiver applications. Position is based in City, Country. The projects are executed in close cooperation with other Product Creation Centers in France (EU) and the Netherlands (EU). The Principal Designer is responsible for the design work for a new product development. He/She likes to work in multicultural and highly complex environments and likes to innovate in product developments.
Your Responsibilities
- Participate in the development of innovative RF and micro/mm-wave circuit designs, pushing the performance of the SiGe/CMOS transistors and passive devices to their limit to maximize the RF IC performance.
- Bring ideas for RF circuit design concepts, perform initial RF simulations to select optimal design concepts for given circuit block(s).
- Circuit design and design implementation to meet the block specification requirements.
- Give guidance to other design and layout engineers on block interaction to optimize overall system performance
- Responsible for design simulations to validate product performance using design kit models
- Participate in design reviews and reporting
Your Profile
- At least 5 years experience in RF IC design, with significant experience in RF power amplifier (PA) design and/or LNA design.
- Experience in optimizing (passive) matching networks in combination with switches.
- Experience with relevant CAD tools (Cadence and ADS) and IC design methodology
- Knowledge of modelling thermal behavior of designs: die-package-PCB
- Experience with modelling metal RF structures and interconnect using EM tools: die -package – PCB
- Good understanding of semiconductor physics
- Structured IC design methodology covering specification, implementation, design and test
- Driven to achieve success and able to participate in a team of expert engineers to reach clear design goal.
- Able to drive technical decisions in a team based on facts and data in order to meet customer committed timelines.
- Fluent in English language both oral and written. Excellent communication skills, both verbal and in writing.
- Initiative and entrepreneurial attitude. Creative.
- Ability to travel globally
