- Advertisement -
The Job is closed. Check the latest active jobs here
Location: Delhi
Company: Arup
Key Duties and Responsibilities
- Lead/Assist in coordinating and executing all technical activities throughout the sales opportunity lifecycle such as technical discovery, product presentations, demonstrations, and evaluations.
- Responsible for providing best in class solutions involving Package and System interactions for Signal and Power Integrity flows and collaborate with the cross regional and cross functional teams for developing suitable solutions.
- Work in Advanced technology areas such as 5G, High Speed and Chip System Designs.
- Participate in external and internal events to further enhance SI/PI/EMI simulation solutions, marketing, and professional growth.
- As a product expert with one or more Ansys products, interact with customers to understand their product design needs and engineering design workflows; analyze how to address customers’ requirements using Ansys products and platform; articulate Ansys’ value proposition.
- Collaborate with the internal teams.
- Contribute to consulting services, conduct introductory and/or intermediate training classes.
Minimum Education/Certification Requirements and Experience
- Required education and degree type: Bachelors or Masters in Electrical/Electronics engineering specialized in Electromagnetics with 2 to 5 years’ experience in High Frequency (HF) domain and simulation tools
- Experience in using programming language (Python, C#, Javascript etc.) for automating simulation workflows.
- Experience with using ANSYS HFSS, ANSYS SIwave and or ANSYS Q3D Extractor or other simulation software involving real world, industry level applications.
- Familiarity with high frequency, microwave and antenna concepts including S-parameters, wave propagation, antenna radiation patterns and scattering analysis
- Familiarity with signal and power Integrity simulation analysis including eye diagram analysis, cross-talk analysis, transmission line impedance simulations, bathtub curves, TDR, power delivery networks and power plane decoupling analysis
- Familiarity with package, printed circuit boards and connector design processes and EDA Tools
- Logical problem-solving, strong interpersonal and communication skills, fluent in writing and speaking English
- Strong organizational and time management skills, possesses a sense of urgency
- Projects a professional image and demonstrates business acumen, driven to succeed
- Ability to travel up to 25% of time.
- Ability to research and debug software related issues
