The power bank design features USB Type-C and Type-A ports, supports fast charging, and includes system-level protection for reliable performance.
Power banks are indispensable portable devices that store electrical energy for later use, primarily for charging battery-powered gadgets like smartphones, tablets, and laptops. They ensure continuous device operation, particularly when away from traditional power sources. This capability not only enhances convenience and accessibility but also provides essential support during emergencies by keeping communication devices operational. With features catering to various devices and needs, including multi-port charging, fast charging, and even solar options, power banks have become a cornerstone of modern digital life, catering to personal convenience and professional necessity. The CCG3PA Power Bank reference design by Infineon Technologies features a portable external battery that stores charge when connected to a charger and subsequently provides power to an attached device.
The design incorporates a USB Type-C receptacle, which can function as a power source or a sink (Dual Role Port). Alongside the USB-C source/sink port, the design accommodates a USB-A source port and a USB-microB sink port. The primary components on the board include Infineon’s EZ-PD CCG3PA controller and the Southchip SC8915 Buck-Boost charger.
The device includes Type-C and USB Power Delivery (PD) support, covering USB PD Revision 3.1, which provides programmable power supply (PPS) mode and configurable resistors R_P and R_D. It accommodates one USB Type-C port and one Type-A port. The device also supports two legacy/proprietary charging blocks compatible with QC 4.0, Apple charging at 2.4A, AFC, and BC 1.2, integrating terminations on DP/DM lines. It features integrated voltage (VBUS) regulation and a current sense amplifier to regulate the secondary side feedback node, with options for direct feedback or optocoupler options. It includes a shunt regulator function for VBUS control, offering constant current or voltage modes. It supports low-side current sensing for constant current control.
For system-level protection, the device features VBUS to CC short protection, on-chip overvoltage protection (OVP), overcurrent protection (OCP), under-voltage protection (UVP), and short circuit protection (SCP), along with overtemperature protection (OTP) through an integrated ADC circuit. The 32-bit MCU subsystem includes an Arm Cortex-M0 CPU, 64-KB Flash, and 8-KB SRAM. Integrated clocks and oscillators eliminate the need for external clocks, supporting a power operation range from 3.0-V to 24.5-V (30-V tolerant).
System-level electrostatic discharge (ESD) protection covers multiple pins with ±8-kV contact discharge and ±15-kV air gap discharge based on IEC61000-4-2 level 4C standards. Packaging options include 24-pin QFN and 16-pin SOIC, which support a temperature range from -40°C to +105°C, ensuring performance across environmental conditions.
Infineon Technologies has tested this reference design. It comes with a bill of materials (BOM), schematics, assembly drawing, printed circuit board (PCB) layout, and more. The company’s website has additional data about the reference design. To read more about this reference design, click here.
