Thursday, January 9, 2025

Advanced Automotive Chips For Safety And Audio

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From occupancy monitoring to premium audio features, these innovative solutions cater to various vehicle categories, setting new standards for safety, efficiency, and immersive sound quality.

New edge AI-enabled radar sensor and automotive audio processors from TI empower automakers to reimagine in-cabin experiences

Texas Instruments (TI) has introduced a suite of new integrated automotive chips designed to enhance safety and elevate in-cabin experiences across all vehicle categories, from entry-level to luxury models. The innovative solutions that bring together edge AI-enabled radar sensors and advanced audio processing technology to revolutionize automotive systems.

TI’s AWRL6844 60GHz mmWave radar sensor, which combines multiple sensing capabilities into a single chip. The sensor integrates three critical features—occupancy monitoring, child presence detection, and intrusion detection—while running AI algorithms at the edge to ensure quick, accurate decision-making. This innovative radar sensor helps create a safer environment by enabling advanced seat belt reminder systems and real-time micromovement detection to identify unattended children, meeting the upcoming European New Car Assessment Program (Euro NCAP) requirements.

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TI improves detection accuracy with the first single-chip 60GHz millimeter-wave radar sensor, supporting three in-cabin sensing applications powered by edge AI. Automotive manufacturers can provide premium audio experiences using a highly integrated Arm®-based microcontroller and processor with TI’s C7x digital signal processor core for top processor performance. Additionally, TI’s new audio amplifier is the first to use one-inductor modulation technology, achieving Class-D performance with only half the number of inductors.

Its edge intelligence reduces false alarms caused by external factors, providing OEMs with a cost-effective solution to meet evolving safety standards. TI’s AM275x-Q1 MCUs and AM62D-Q1 processors enable premium audio features at an affordable price. By incorporating TI’s next-generation audio DSP core, these automotive systems-on-chip (SoCs) make immersive in-car audio accessible to a wider range of vehicles. 

The key features include:

  • Supports spatial audio, active noise cancellation, and sound synthesis
  • Advanced vehicle networking with Audio Video Bridging over Ethernet
  • Dolby Atmos for high-quality audio in compact systems
  • Integrated with TI’s TAS6754-Q1 Class-D audio amplifier
  • Reduces design complexity and enhances audio quality with low power consumption

Amichai Ron, Senior Vice President at TI, emphasized the company’s commitment to delivering advanced technologies that cater to the growing demand for enhanced driving experiences. “Our radar sensors and audio SoCs enable automakers to provide safer and more responsive vehicles, while transforming the in-cabin experience with immersive audio.”

Akanksha Gaur
Akanksha Gaur
Akanksha Sondhi Gaur is a journalist at EFY. She has a German patent and brings a robust blend of 7 years of industrial & academic prowess to the table. Passionate about electronics, she has penned numerous research papers showcasing her expertise and keen insight.

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