The X-ray inspection system revolutionises quality control with AI technology, high-resolution cameras, and comprehensive tools for accuracy and efficiency in manufacturing.
Scienscope’s Xspection 3000 is the pinnacle of offline X-ray inspection systems, setting new standards in quality assurance and process stability. With options like the premium 130kV closed-tube technology, it represents the ultimate in unwavering quality control.
The X-ray inspection system offers a comprehensive suite of hardware and software features to ensure optimal quality assurance and process stability in your manufacturing facility.
The newly introduced AI technology features a sophisticated self-learning algorithm that differentiates poor and high-quality images. It continuously refines its ability to accurately identify and classify images based on the data it receives. Additionally, the improved TH barrel fill tool is precisely engineered to detect and rectify voids that may arise during the through-hole filling process, aiming to boost the overall quality and dependability of the final product. Furthermore, the integration of two high-resolution colour cameras, each with a 20-megapixel capacity, enhances mapping precision and enables upgrades for barcode reading and optical inspection.
Some of the key features of the X-ray inspection system include:
- Fully integrated 100kV or 130kV microfocus sealed tube
- Spot size down to 5µm
- Larger flat panel detector for an increased field of view
- Additional mapping camera for close-up image capture
- Self-learning AI software for easy programming
- Upgraded XY table to servo-driven for faster cycle times
- Optional 360-degree rotating stage that is lighter and faster
- More accurate VOID calculation with better background definition
- Enhanced BGA tool to reduce false alarms
- Industrial PC with Microsoft Windows 11
This system results from years of expertise and continuous input from our global clientele. The company claims that industry experts have recognized the Xspection 3000 as an unparalleled tool for various applications, including but not limited to multilayer PCBs, void detection, semiconductors, through-hole technology (THT) barrel fill, and lithium batteries.
