Wednesday, November 13, 2024

BCD Solution For Next-Gen Power And Sensing Applications

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The Platform simplifies design, cuts costs, and accelerates time-to-market for automotive, medical, industrial, and AI applications. 

Onsemi unveils the Treo Platform, a analog and mixed-signal solution built on the advanced 65nm Bipolar-CMOS-DMOS (BCD) process technology. This platform provides a versatile foundation for power and sensing products, catering to high-performance, low-power, and highly efficient applications. It’s a scalable solution designed to streamline and expedite product development across multiple sectors, empowering customers to tackle current and emerging challenges seamlessly.

With rising power demands in automotive, industrial, and AI-driven data centres and tightening environmental regulations, industries require solutions that simultaneously boost performance and energy efficiency. Moreover, the market for low-power devices, like medical wearables, is growing, demanding more innovative, more efficient designs. Treo responds to these needs by integrating advanced features and efficiency across the power spectrum, facilitating intelligent solutions with superior energy management.

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Applications and Benefits

  • Automotive:High-performance ultrasonic sensors double the accuracy of park assist systems, enabling detection of closer objects, which enhances safety by preventing collisions.
  • Healthcare:In continuous glucose monitors (CGMs), Treo’s ultra-low-power Analog Front Ends (AFEs) capture precise nanoampere-level currents, critical for accurate readings. By integrating functions into a single chip, Treo cuts the device footprint in half, extending battery life and offering patients a more comfortable, cost-effective solution.
  • Data Centers: The platform’s intelligent power stages optimise power delivery to CPUs and GPUs, reducing cooling needs and lowering energy consumption. This leads to a more sustainable and cost-effective data centre operation.

The Platform utilizes a modular system-on-chip (SoC) architecture with an evolving set of IP building blocks for computing, power management, sensing, and communications. Built on the 65nm process, it supports a wide voltage range of 1-90V and high temperatures up to 175°C, ensuring robust performance and flexibility across diverse applications. This adaptability accelerates onsemi’s capacity to deliver customised solutions tailored to specific market needs.

The products, such as voltage translators and ultrasonic sensors, are now being sampled. An expanded lineup, including high-performance sensors, DC-DC converters, and connectivity solutions, is planned through 2025.

For more information, click here.

Akanksha Gaur
Akanksha Gaur
Akanksha Sondhi Gaur is a journalist at EFY. She has a German patent and brings a robust blend of 7 years of industrial & academic prowess to the table. Passionate about electronics, she has penned numerous research papers showcasing her expertise and keen insight.

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