The Dimensity 6100+ Chipset is suitable for upcoming 5G devices, enabling enhanced 5G capabilities and good power efficiency at a pocket-friendly cost.
MediaTek Unveils Dimensity 6100+ Chipset for Next-Generation Mainstream 5G Devices. The company claims that the system on chip (SoC) is designed to empower the next wave of mainstream 5G devices. With its good power efficiency, vivid displays, AI-powered camera technologies, and reliable 5G connectivity, the Dimensity 6100+ chipset offers great features at a competitive price point, thus making budget smartphones more powerful and feature-rich.
According to the company, the main features of the new SoC include an enhanced 5G modem and power efficiency. The Dimensity 6100+ integrates an enhanced 5G modem, adhering to the 3GPP Release 16 standard and supporting up to 140MHz 2CC 5G Carrier Aggregation. The higher energy efficiency of the SoC contributes to a longer battery life, enhancing the overall user experience.
The company claims that the SoC comes with two Arm Cortex-A76 big cores and six Arm Cortex-A55 efficiency cores, thus enabling a powerful performance. Moreover, it also supports AI-powered cameras, enabling features like AI-bokeh for stunning portraits and selfies. Additionally, MediaTek’s collaboration with Arcsoft brings AI-color technology to mainstream devices. It also enables the immersive visual experience. The Dimensity 6100+ chipset supports up to 108MP Non-ZSL camera support and up to 2K 30fps video capture, ensuring high-quality imaging and video recording capabilities. Furthermore, it offers premium 10-bit display support, reproducing over one billion colors for vibrant images and videos. With support for 90Hz to 120Hz frame rates, users can enjoy a smooth and immersive visual experience.
