Sunday, September 15, 2024

High-Speed Chip Mounter Reforms SMT And THT Production

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With advanced configurability, precision placement, and the ability to handle a wide range of components and PCB sizes, it offers manufacturers an ideal solution for optimizing their production processes.

Hanwha Precision Machinery has launched the XM520, a generalpurpose chip mounter that is setting new benchmarks in Surface Mount Technology (SMT) and ThroughHole Technology (THT) production. This versatile and highperformance machine is designed to elevate productivity and quality across various product types and production line configurations, making it a gamechanger in the industry. The High-Speed Dual Lane Chip Mounter was recently awarded the 2024 NPI Award in the Component Placement High-Speed category, recognizing its capabilities in high-speed component placement.

Its design prioritizes extensive configurability, offering many options that can be customized to specific production requirements. The system is equipped with advanced tools like the Stage Camera, Docking Cart, and Tray, enabling seamless integration and operation in diverse manufacturing environments.Its speed, accuracy, and flexible production capabilities make it an ideal choice for manufacturers aiming to optimise their production lines while maintaining the highest standards of quality and efficiency.It is designed to integrate seamlessly into various production settings. 

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The key features include:

  •  Optimal placement speed: Up to 100,000 components per hour (CPH)
  •  Accuracy: Precision of ±22 μm at a Cpk ≥ 1.0
  •  Component size range: Supports from tiny 0201 chips to components up to 22 mm
  •  PCB handling capability: Accommodates PCB sizes up to L150 x 55 mm
  • Compact: L 1,430 x D 1,900 x H 1,994 mm

It can accommodate quick and automatic job changes, significantly reducing downtime and enhancing overall efficiency. This flexibility is further demonstrated by its capacity to handle various components and PCBs, making it adaptable to the most demanding production requirements. It has a dual gantry design with a 10spindle configuration and is a versatile and compact solution designed for manufacturers, delivering high-speed component placement and exceptional accuracy. It can handle a wide range of component sizes, from the most miniature chips to more significant components, and can accommodate various PCB sizes. Despite its compact dimensions, the system is robust and highly suitable for diverse manufacturing needs, offering precision and efficiency in component placement. 

Akanksha Gaur
Akanksha Gaur
Akanksha Sondhi Gaur is a journalist at EFY. She has a German patent and brings a robust blend of 7 years of industrial & academic prowess to the table. Passionate about electronics, she has penned numerous research papers showcasing her expertise and keen insight.

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