Murata develops ultra-low power Wi-Fi HaLow modules, advancing long-range IoT applications with enhanced energy efficiency and private network capabilities.
Murata Manufacturing Co., Ltd., Japan has developed two advanced Wi-Fi HaLow modules, Type 2HK and 2HL, designed for IoT applications requiring long-range, low-power connectivity. Compliant with Sub-1GHz Wi-Fi standards, these modules make reliable communication over distances exceeding 1km, addressing diverse smart device and industrial needs globally.
The compact modules support varied power levels, with Type 2HK offering +23dBm high-power capability and Type 2HL providing +13dBm low-power efficiency. These features make them ideal for industries such as smart homes, medical devices, industrial automation, and energy management systems, alongside developers of security systems and building automation solutions. Their versatility also appeals to organisations requiring cost-efficient private networks for remote areas.
“Thanks to Murata’s proprietary high-density packaging technology, these modules deliver robust communication in a compact, surface-mount package,” explains Masatomo Hashimoto, director of communication & sensor business unit, Murata.
Designed for private networks, the modules minimise the need for repeaters in conventional Wi-Fi/IP setups, offering improved area coverage and reduced system costs. Their compatibility with IP-native standards simplifies implementation while creating image and video transmission in remote or hazardous locations. This functionality promotes automation and sustainability by reducing energy and operational costs.
Powered by the Newracom NRC7394 chipset featuring an Arm Cortex-M3 processor, the modules are equipped to handle Wi-Fi subsystems and user applications effectively. They support frequencies of 902MHz–928MHz (Type 2HK) and 750MHz–950 MHz (Type 2HL), with a robust SPI interface and versatile peripherals like UART, I2C, and GPIO. Highlighting the chipset’s capabilities, Dr. Sok Kyu Lee, chief executing officer, Newracom, states, “This represents the future of Wi-Fi for IoT applications, offering unique range and efficiency.”
The modules come in a durable LGA package with a 19mmx13.9mm footprint and operate within -40°C to +85°C, making them suitable for diverse environmental conditions. With this innovation, the company continues its commitment to advancing IoT technologies, providing smarter and more sustainable solutions within industries.
