The power supply technology is designed for military and aerospace applications, offering efficiency, durability, and compliance with standards.
![PSDG-48](https://www.electronicsforu.com/wp-contents/uploads/2024/05/PSGD-48_1-478x500.png)
Gaia Converter has expanded its military and aerospace power systems offerings with the PSDG-48 series board mount module. The series includes isolated power supplies with 2 or 3 outputs, each providing 48W, designed with an emphasis on SWaP-C and a profile of 91×54×9 mm.
The PSDG-48 series is a multi-output, 48W isolated power supply board mount module designed for 24 & 28VDC military and reliability applications. This module meets power supply standards including MIL-STD-461, MIL-STD-704, MIL-STD-1275, ABD100, and DO160. It features an integrated EMI filter, reverse polarity protection, and a hold-up function managed with an external capacitor for 50ms transparency timing.
Additionally, the module is capable of handling high and low input voltage transients and inrush current limits, and offers protection against short circuits and over-voltage in outputs. It operates within a temperature range of -40°C to +105°C under full load. The module is suitable for rugged applications, complying with MIL-STD-202 and 810 standards for altitude, humidity, temperature shocks and cycles, as well as mechanical vibrations and shocks.
The PSDG series employs a fixed high-frequency switching topology that achieves high power density and excellent reliability in a low-profile package. The series is fully encapsulated with thermally conductive resin, which ensures optimal power dissipation in harsh environments. Additionally, it offers a complete power supply efficiency of up to 87%.
Some of the3 key power features of the PSDG series include:
- Input voltage: 16 – 60 Vdc
- Output power: 48W (configurations of 20W+20W+8W or 40W+0W+8W)
- Voltage options: Single-ended or symmetrical
- Efficiency: Up to 89%
- Operating temperature: -40°C to +105°C (full load)
The module uses a high-frequency switching topology for power density and reliability and is encapsulated in thermally conductive resin to enhance power dissipation in challenging environments.