 Soldering is one of the most important processes in the manufacturing of any electronics module, and to enhance the strength of soldering joint and create smooth solder joints, SHENMAO America, Inc. has released an enhanced Solder Joint Encapsulation Material (SJEM) SMEF-Z52 Flux. To provide higher bonding strength and joint protection, the SJEM flux combines the ability of conventional flux and underfill. It provides great joint protection along with an excellent bonding strength as the epoxy cures after the reflow process.
According to the company, the SMEF-Z52 is an active epoxy flux designed for SMT assembly (SAC paste) and BGA ball mount (SAC ball) processes. The activator helps to eliminate solder balls and form smooth solder joints. It provides better mechanical support to joints after the reflow process and offers a 30% higher strength compared to the conventional Rosin flux. The epoxy flux residue is cured and provides mechanical support to the joint after reflow.
The company claims that the SMEF-Z52 flux doesn’t require cleaning and has excellent compatibility with moulded underfill (MUF) and capillary underfill (CUF). The newly developed flux can be used for a wide variety of soldering process which includes jetting, dipping, stencil printing, dispensing, and pin-transfer processes and is suitable for multiple IC packages, such as wafer-level-package (WLP), system-in-package (SIP), and flip-chip. The halogen-free (REL0) flux complies with RoHS, RoHS 2.0 and REACH.
