Saturday, November 23, 2024

SiP For IoT Applications Combining Both BLE and LoRa

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A low-power solution that can enable IoT devices to work for years on a single battery charge.

iMCP HTLRBL32L SiP (Source: HT Micron)

The iMCP HTLRBL32L system-in-package (SiP) from HT Micron can enable communication to an IoT solution. The iMCP HTLRBL32L combines Bluetooth Low Energy and LoRa to enable easy integration and prototyping of long and short-range IoT solutions. The product comes in a small package measuring just 13x13x1.1mm.

The low-power solution can enable IoT devices to work for years on a single battery charge. It features an accessible MCU and internal memory, and a full range of interfaces for analog and digital peripherals, it also provides high configurability and flexibility for IoT applications. The iMCP HTLRBL32L can enable designers to build low-cost, low-power, compact IoT solutions that can find applications in a large field of applications including, smart farming, smart building, smart logistics, etc.

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The SiP iMCP HTLRBL32L allows easy integration and prototyping of long- and short-range IoT solutions. The energy-efficient SiP is powered by an ARM Cortex M0+ processor and features a Semtech SX1262 LoRa radio transreceptor. It offers an accessible MCU and internal memory and a full range of interfaces for analog and digital peripherals allowing for high configurability and flexibility for IoT applications.

The iMCP HTLRBL32L also features a secure element that ensures authentication and data management services for a local or remote host for high-level security.
The SiP is ready for multi-region LoRaWAN applications and for device commissioning, wireless firmware update and mesh network capabilities using Bluetooth Low Energy 5.2.

The SiP also supports various analog and digital communication protocols including ADC, SPI/I2S, I2C, USART and LPUART, gaining higher versatility for embedded system development and more flexibility in the integration and design of IoT devices which use the iMCP HTLBL32L as communication module integrated with other components. The module is suitable for use in applications such as smart buildings, smart agriculture, smart cities, etc.


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