Infineon Technologies AG has released the 3rd generation of HYPERRAM to its family of high-bandwidth, low-pin count memory solutions. The HYPERRAM 3.0 is a stand-alone pSRAM-based volatile memory that makes adding more RAM to your application easier and cheaper. The low-power, cost-effective stand-alone pSRAM features a 16-bit extended version of the HyperBus with a throughput of 800 MBps which is twice the throughput compared to the previous generation HYPERRAM 2.0. The HYPERRAM 3.0, is suitable for applications requiring expansion RAM memory such as automotive vehicle-to-everything (V2X) and applications requiring scratch-pad memory for intense mathematical calculations.
According to the company, the PSRAM-based HYPERRAM 3.0 offers data rates equivalent to SDR DRAM but with much lower pin-count and lower power requirements. It allows for creating a less-complex, low-cost solution since the HyperBus interface makes it possible to use microcontrollers (MCUs) with fewer pins and PCBs with fewer layers. The HYPERRAM 3.0 features a 16-bit extended version of the HyperBus interface that doubles throughput to 800 MBps.
“With nearly three decades of memory solutions knowledge, we are excited to bring another industry-first to the market. The new HYPERRAM 3.0 memory solutions achieve a far higher throughput-per-pin than existing technologies in the market such as PSRAMs and SDR DRAMs,” said Ramesh Chettuvetty, Senior Director of Applications and Marketing at Infineon’s Automotive Division. “Our low-power features enable better power consumption, without sacrificing throughput, which also makes this memory ideal for industrial and IoT solutions.”
The HYPERRAM 3.0 products are available in a BGA-49 package, the AEC-Q100 devices are available in a density range of 64 Mb to 512 Mb. The HYPERRAM 3.0are is suitable for automotive and industrial environments with temperatures up to 125°C. These are a perfect fit for applications requiring expansion RAM memory such as video buffering, factory automation, vehicle-to-everything (V2X), etc.
Key Features of HYPERRAM 3.0:
- Small Form Factor – FBGA package to ensure small PCB footprint
- Low Pin-Count – Low pin-count to aid design simplicity and reduce system cost
- Low Power – Hybrid sleep mode and partial array refresh for energy efficiency
- High Throughput – High read/write bandwidth to maximize system performance
