An innovation in semiconductor packaging allows for ultra fine copper circuits, improving processing speed and functionality.
Resonac Corporation, Japan has introduced an ideal photosensitive film that supports the manufacturing of advanced semiconductor packages, particularly AI processors. This film facilitates the creation of ultra fine copper circuits with a line width and spacing of 1.5μm on organic interposers. The innovation marks a significant step in the miniaturisation and efficiency of semiconductor packaging technologies.
With the increasing complexity of semiconductors, integrating multiple functions on a single chip has become crucial for higher speeds and computational capabilities. The development of chiplet technology, which connects multiple chips on an interposer, has brought advancements in achieving compact and efficient packaging. However, challenges such as yield rates arise when larger interposers are required, especially when using wafer-based manufacturing.
This new film is particularly valuable for industries requiring high-performance and compact electronics, including AI development, cloud computing, and high-speed data processing applications. Semiconductor manufacturers, electronic design engineers, and companies focusing on next-generation computing hardware stand to benefit significantly from this innovation. Organic interposers, enhanced by the film’s capability to achieve a resolution of 1.5μm, provide a scalable and reliable solution for panel-based manufacturing processes.
“Achieving this level of resolution required the development of a novel polymer resin,” the company stated. The resin was designed through collaboration between four organisations, using AI to optimise resin properties. The research centre for computational science and informatics provided AI expertise, while the institute for polymer technology led the resin’s material development. Meanwhile, the photosensitive materials development department formulated and processed the resin into the photosensitive film, which was tested and verified at the company’s packaging solution centre.
This invention promises to meet the growing demand for high-performance semiconductor packaging in emerging technologies, including AI and advanced computing. The company remains committed to advancing materials that shape the future of semiconductors, enabling faster and more efficient processing for modern devices.
