The 100V GaN power stages, featuring thermally enhanced package technology, enable a reduction in solution size by over 40% while improving power efficiency through a 50% decrease in switching losses.
Texas Instruments (TI) has unveiled two innovative power conversion device portfolios to enable engineers to achieve higher power density in more compact spaces while reducing costs. The new 100V integrated gallium nitride (GaN) power stages are designed with thermally enhanced dual-side cooled package technology, offering unparalleled power density in mid-voltage applications, exceeding 1.5kW/in³. Additionally, TI’s groundbreaking 1.5W isolated DC/DC modules with integrated transformers are setting industry standards as the smallest and most power-dense solutions, significantly reducing the size of isolated bias power supplies in automotive and industrial systems by over 89%.
The key features include:
- The 100V GaN power stages enable an over 40% reduction in size for mid-voltage power supply solutions, leading to industry-leading power density.
- GaN technology allows for higher switching frequencies, resulting in 50% lower switching power losses than silicon-based solutions and achieving system efficiencies of 98% or higher.
- In applications like solar inverters, the GaN technology enables more power storage and production by the same panel while reducing the microinverter system’s size.
- Thermally enhanced dual-side cooled package technology is crucial for the thermal performance of the 100V GaN portfolio. It allows for more effective heat removal from both sides of the device and provides improved thermal resistance compared to other integrated GaN devices.
The new 1.5W isolated DC/DC modules, UCC33420-Q1 and UCC33420, provide the highest output power and isolation capability (3kV) in the industry for automotive and industrial systems, all within a 4mm-by-5mm very thin small outline no-lead (VSON) package. These modules use integrated transformer technology, eliminating the need for an external transformer in bias supply designs. This innovation enables a reduction in solution size by more than 89%, a decrease in height by up to 75%, and a halving of the bill of materials compared to discrete solutions.
The first automotive-qualified solution in this compact package allows designers to minimize the footprint, weight, and height of bias supply solutions for electric vehicle systems, such as battery management systems. For industrial power delivery in data centers, where space is at a premium, the new module enables a significant reduction in printed circuit board area.
Kannan Soundarapandian, General Manager of High Voltage Power at TI, emphasized the importance of delivering more power in constrained spaces for power-supply designers. He highlighted the potential impact on data centers, where power-dense server power supplies could lead to more efficient operations and a smaller environmental footprint. TI’s commitment to pushing the boundaries of power management is evident in these new offerings that prioritize power density, efficiency, and thermal performance.
