Thursday, December 26, 2024

Semiconductor Solutions For  IO-Link Market

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With IO-Link adoption growing at over 20% annually, these products provide tools for developers to accelerate innovation and tackle modern challenges in smart factories.

Renesas Electronics Corporation has introduced two  semiconductor products tailored for the fast-growing IO-Link market: the CCE4511 Four-Channel IO-Link Master IC and the ZSSC3286 Dual-Channel Sensor Signal Conditioner IC.  

IO-Link is a standardized digital communication protocol widely used in industrial automation, offering seamless interaction between sensors, actuators, and control systems. Its ability to provide real-time data, diagnostics, remote configuration, and efficient wiring makes it highly desirable for modern automation. Industry research forecasts the IO-Link market to grow at over 20% annually, potentially surpassing $34 billion by 2028.  

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Four-Channel IO-Link Master IC  

It  is the industry’s first four-channel master IC, featuring 500mA driving current per channel, reducing energy consumption, PCB size, and external component needs. This IC integrates a high-voltage interface with overvoltage detection and over-current protection for robust performance.   An integrated IO-Link Frame Handler automates communication tasks, easing the load on microcontrollers (MCUs), allowing designers to use less expensive MCUs or boost overall system performance. With an operating temperature of up to 125ºC, the CCE4511 supports harsh industrial environments and fulfills the IO-Link Safety System Extension requirements.  

IO-Link Ready Dual-Channel Sensor Signal Conditioner IC  

It is designed for precise amplification, digitization, and correction of sensor signals. It supports IO-Link Smart Sensor Profile connectivity, eliminating the need for an additional MCU to run the stack, thus saving space and cost. This IC features dual 24-bit ADCs, a measurement scheduler, and advanced system diagnostics. It’s suitable for bridge sensors and provides digital compensation for offset, sensitivity, temperature drift, and non-linearity through an integrated 32-bit Arm-based core.  

The company offers the IO-Link Sensor Winning Combination—a pre-verified system architecture integrating both the IC’s with other components to accelerate product development and minimize design risks.   Both the IC’s are available now, along with evaluation kits for developers. 

For more information, click here. Link1 and Link 2.

Akanksha Gaur
Akanksha Gaur
Akanksha Sondhi Gaur is a journalist at EFY. She has a German patent and brings a robust blend of 7 years of industrial & academic prowess to the table. Passionate about electronics, she has penned numerous research papers showcasing her expertise and keen insight.

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