Powerful Industrial PC With 11th Gen Intel Tiger Lake Processor

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Equipped with a wide array of I/O interface, supports 5G and provides low latency multi-connections for IoT and AIOT related applications

Avalue Technology has unveiled the latest Tiger Lake UP3 fanless box PC EMS-TGL. Tiger Lake is the 11th Generation Intel Core Processor Family for the Internet of Things (IoT) Applications. 11th Gen Intel Core processors deliver a balance of performance and responsiveness in a low-power platform built on third-generation 10nm process technology. The platform combines a high-performance CPU, up to 23% faster single-thread performance and up to 19% faster multi-thread performance. 

Avalue EMS-TGL fanless box PC is adopted with the 11th Gen Intel Core i3/i5/i7 processors and 2 x 260-pin SODIMM socket max. up to 64GB DDR4 3200 MT/s with just less than 15W TDP, is a low-power and high-performance Computing. 

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EMS-TGL is equipped with a wide array of I/O interface, including 4 x USB3.1, 1 x DP, 1 x HDMI, 2 x COM, 2 x LAN, 1 x 8bit GPIO can also be added according to customers’ requirements, giving it high expandability. 

EMS-TGL also supports 5G (Sub-6G) module, M.2 NVMe SSD Gen. III x 4, HDMI 2.0b (4K @ 60Hz), LAN 2.5G Base-Tx GbE. To meet 5G technology trend, it is able to provide high speed, low latency and multi-connections for IoT and AIOT related applications.

With new Intel Iris Xe graphics, the platform offers up to 2.95 times faster graphics performance, plus PCI Express 4.0 and Thunderbolt 4/USB4. Compared with the 8th Gen Intel Core processors with 24EU, 11th Gen Intel Core processors got up to 96EU. With advanced graphics, media and display performance, EMS-TGL supports applications like digital signage and smart retail (including AI-enhanced for analytics), as well as computer vision with inferencing capabilities for uses like network video recorders or machine vision and inspection.

The rugged structural design can withstand strong vibrations or impacts and operate normally under extreme weather conditions. To be a strong embedded system used in a harsh environment, EMS-TGL is given with several ruggedised features: metal chassis with an IP-50 rating, fanless operation with sufficient thermal solutions, passes anti-shock (5G) and anti-vibration (55G) test. Furthermore, wide operation temperature (0~70°C (ST)/ -40 ~70°C (WT)) and wide voltage (+9 ~ +32 V) input with anti-interference capability protect the computer from overload short circuits and guarantee a normal function system in demanding industrial applications.

EMS-TGL supports an innovative IET (Intelligent Expansion Technology) interface which offers flexibility to integrate multiple I/O, or to develop the extension module following the project request.

EMS-TGL is engineered to deliver reliability applications, such as:

• Industrial/ Energy
• Office automation
• Retail
• Public sector
• Automotive
• Vision systems
• Transportation

EMS-TGL main features:

• Onboard 11th Gen. Intel® Core™ i7/i5/i3 BGA Processor
• 2x 260-pin SODIMM socket Max. up to 64GB DDR4 3200MT/s
• Rich I/O, 4-USB3.1, 1-DP, 1-HDMI, 2-COM, 2-LAN, 1-8bit GPIO
• Support 5G (Sub-6G) module, M.2 NVMe SSD Gen. III x 4, HDMI 2.0b (4K @ 60Hz), LAN 2.5G Base-Tx GbE 
• Fanless operation temperature from -40°C ~ 70°C (WT) / 0°C ~ 70°C (ST)
• CE, FCC Class B, IP50 
• Wide range DC power input from +9~32V
• Support HW TPM 2.0
• Support vPro