Tuesday, September 10, 2024

Open Standard Module For Embedded Computing

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The Open Standard Module by SGET sets a new standard in embedded computing, designed for diverse IoT applications and rugged environments.

OSM

ADLINK Technology Inc. has introduced the Open Standard Module (OSM) by SGET, a benchmark in embedded computing. As a member of the SGET committee, ADLINK significantly shaped the development of these compact, open-standard, solderable BGA mini modules that support both Arm and x86 architectures and offer a smaller form factor than existing computer-on-modules.

OSM sets a new standard in size efficiency, with the largest module measuring just 45mm x 45mm—28 % smaller than the Qseven modules and 51% smaller than the SMARC modules. Despite its size, OSM boasts 662 pins, providing more connectivity than SMARC’s 314 and Qseven’s 230 pins.

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The BGA design optimizes interface density on a smaller footprint, which is crucial for the increasing complexity of requirements in various IoT applications. It combines modular computing benefits with the need for cost efficiency, minimal space usage, and versatile interfaces.

Additionally, OSM modules typically consume less than 15W of power and are designed as soldered-down solutions, making them suitable for environments with extreme vibration and ideal for rugged applications.

ADLINK is at the forefront of this transformative technology with the OSM product line, featuring standout modules like OSM-IMX93 and OSM-IMX8MP. This initiative marks the beginning of new developments in embedded computing.

Some of the key features of the Open Standard Module include:

  • OSM revision 1.1 compliant
  • NXP i.MX8M Plus series with 4-core Arm Cortex-A53 & M7
  • In-SoC 2.3 TOPS NPU
  • HDMI, LVDS, DSI graphic output interfaces
  • Dual GbE (one TSN capable)

“As pioneers in establishing the OSM form factor, we’re committed to delivering even more innovative solutions, empowering customers to unlock new possibilities. The OSM sets the stage for continuous computer-on-module innovations, and we are proud to be at the forefront of every edge computing solution,” said Henri Parmentier, Senior Product Manager at ADLINK COM BU.

For more information, click here.

Nidhi Agarwal
Nidhi Agarwal
Nidhi Agarwal is a journalist at EFY. She is an Electronics and Communication Engineer with over five years of academic experience. Her expertise lies in working with development boards and IoT cloud. She enjoys writing as it enables her to share her knowledge and insights related to electronics, with like-minded techies.

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