The Power Integrated Modules in an F5BP package enhance utility-scale solar and ESS efficiency, potentially saving significant energy and reducing costs.
Onsemi has introduced hybrid Power Integrated Modules (PIMs) that combine silicon and silicon carbide technologies. These modules, housed in an F5BP package, are designed to enhance the power capabilities of utility-scale solar string inverters and energy storage system (ESS) applications. The new generation of modules boosts power density and efficiency, increasing the total system power of a solar inverter from 300kW to 350kW. A utility-scale solar farm with a one gigawatt (GW) capacity using these modules could save nearly two megawatts (MW) per hour, equivalent to powering over 700 homes annually. Furthermore, the upgraded modules require fewer units to reach the same power levels as earlier versions, potentially reducing the costs of power device components by over 25%.
Solar energy now has the lowest levelized cost of energy (LCOE), making it an increasingly favoured option for renewable power globally. To manage solar power’s variability, utility operators are incorporating large-scale battery energy storage systems (BESS) to maintain consistent energy delivery to the grid. The demand for power conversion solutions is growing as these developments progress. Even a minor efficiency increase of 0.1% could translate into significant annual savings—up to a quarter of a million dollars for each gigawatt of capacity installed.
The F5BP-PIMs integrate 1050V FS7 IGBTs and 1200V D3 EliteSiC diodes to enhance high voltage and current power conversion by reducing power dissipation and boosting reliability. The FS7 IGBTs cut turn-off losses and decrease switching losses by 8%, while the EliteSiC diodes improve switching performance and reduce voltage flicker by 15% compared to prior models.
These PIMs feature an I-type Neutral Point Clamp (INPC) for the inverter module and a flying capacitor topology for the boost module. They incorporate an electrical layout and Direct Bonded Copper (DBC) substrates to minimise stray inductance and thermal resistance. A copper base plate further cuts thermal resistance to the heat sink by 9.3%, keeping the module cool under high loads. This thermal management ensures efficiency and longevity in demanding power delivery applications.
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