Features multiple depth sensing and distance measurement for fast-growing markets such as mobile, AR/VR, retail, robotics and automation
Tower Semiconductor and Opix have announced the successful development of a world-class iToF technology platform for 3D imaging and face recognition, featuring multiple depth sensing and distance measurement applications for a broad range of markets.
The newly developed technology is implemented in a high-end image sensor product that is being integrated into a 3D camera module in partnership with an organisation involved in 3D cameras and imaging systems for mobile applications. This three-party collaboration has produced a unique sensor product that is perfectly suited to serve a wide variety of fast-growing markets such as mobile, AR/VR, retail, robotics, automation and industrial inspection.
Utilising TOWER’s 65nm leading pixel-level stacked BSI CIS technology as well as Tower’s expertise in the development of iToF image sensor technology, provided an outstanding platform for the design of this cutting-edge performing product, a first in a series of iToF products.
“This highly advanced technology comprehensively meets the challenging requirements and specifications of a small-sized iToF imager and demonstrates our notable capabilities and fervent commitment to provide our customers with market-leading imaging solutions,” said Dr Avi Strum, Senior Vice President and General Manager of the Sensors and Displays Business Unit, Tower Semiconductor.
The first sensor that is currently being prototyped to customers features a 5µm 3-tap state-of-the-art iToF pixel incorporating a pixel array with a resolution of 640×480 pixels. The BSI technology provides excellent sensitivity at NIR wavelengths. Also, the wafer stacking enables very high modulation frequencies of up to 165 MHz and 30 depth frames per second which results in industry-leading depth accuracy at short, mid and long-range distances even in challenging ambient light conditions by using pulse modulation iToF technique.
Advanced features such as multiple acquisition modes, depth with single and dual-frequency, low-power standby modes and an industry-standard MIPI CSI-2 interface allow versatile and flexible operation, providing a cost-effective all-in solution and making this product the ultimate choice for various 3D imaging applications, especially in the mobile market.
“With our 100% focus and dedication to 3D imaging and support of our partners, we have a strong belief we can play an important role in the coming years to serve the market with innovative solutions for the emerging 3D imaging market,” said Dr Xinyang Wang, CEO at Opix.
